Ctech-alpha

CORE BUSINESS

System in a package

In the past 50 years, semiconductor technology has been continuously following Moore's Law, which can accurately predict the evolution of semiconductor processes. The progress and development of System in Package (SiP) system level packaging have expanded the evolution of Moore's Law, integrating multiple cores, components, and other packaging materials together to form a complete system module packaging, effectively improving system integration and performance, Reduce product volume and reduce power consumption and costs. Through SiP technology, different functional cores can be combined together to form a highly integrated system, achieving complex application solutions.

SiP系统级封装

SiP miniaturization

The IoT SiP packaging solution reduces peripheral materials by 60%, resulting in smaller dimensions and lower power consumption.
SiP微小化
SiP微小化
SiP微小化

SiP encapsulation type

The drone SDR SiP packaging solution, with built-in LNA SW PA RF Transceiver, makes the drone lighter in weight, longer in operation time, and longer in flight distance.
Hybrid(flip chip+wirebond)
SiP - single sided
SiP封装类型
SiP封装类型
SiP封装类型
eWLB-PoP & 2.5D SiP
SiP封装类型
SiP封装类型
SiP封装类型
fcFBGA/LGA SiP
SiP封装类型
SiP封装类型
SiP封装类型

SiP package design

With years of experience in RF modules and SiP, Zhongke has designed products with strong electromagnetic anti-interference ability and reliable welding quality.
SiP
  • FC-BGA/LGA/CSP
  • QFN/DFN/PDFN
  • WB-BGA/LGA
  • PoP/PiP
  • Hybrid Package
SiP封装设计
SiP封装设计
WLP
  • RDL & Bumping
  • Interposer
Module
  • COB/Embedded Module
SiP封装设计
SiP封装设计
Module
  • μModule(Power/IoT etc.)
SiP furnace temperature welding of tin balls
  • FC-BGA/LGA/CSP
SiP封装设计
SiP封装设计
SiP laser solder ball
  • QFN/DFN/PDFN

SiP simulation

Professional SIP encapsulated EDA tools and simulation capabilities, designed to provide high-quality product performance and signal indicators.
SiP仿真
Power Integrity
  • DC voltage drop analysis
  • Resonance simulation analysis
  • Power impedance analysis
  • Current density simulation
  • Simultaneous Switch Noise
SiP仿真
Thermal effect analysis
  • Packaging thermal resistance analysis
  • Material selection analysis
  • HotSpots
  • Structural optimization
SiP仿真
Eye map integrity
  • The contour curve and bathtub curve are the standards for evaluating the quality of signal transmission
SiP仿真
Mechanical
  • Material analysis and selection
  • warp analysis
  • stress analysis
Signal integrity
  • The S parameter, as a basic indicator of the transmission quality of high-frequency signals, is also an essential parameter for electromagnetic simulation.
    By electromagnetic simulation, corresponding S parameters can be obtained for various fine structures and SPICE models can be output
  • RLC&S parameter extraction, high-speed signal simulation/optimization, signal interference simulation analysis, impedance control and optimization
SiP仿真
SiP仿真
SiP仿真
SiP仿真

SiP Testing

Zhongke SiP packaging core testing is a customized advanced turret design project that integrates 16 (300-7GHz RF testing units) and can be tested according to different product communication protocols (NB IoT, CAT1, 4G, 5G, WIFI 6), which is 10 times the output of traditional testing projects.