Over the past 50 years, semiconductor technology has been advancing in accordance with Moore's Law. Through Moore's Law, the evolution of semiconductor processes can be accurately predicted, and the progress and development of System in Package (SiP) have greatly expanded the evolution of Moore's Law. Multiple chips, components, and other packaging materials are integrated together to form a complete system module package, effectively improving system integration and performance, reducing product volume, and lowering power consumption and costs. Through SiP technology, chips with different functions can be combined together to form a highly integrated system, enabling complex application solutions.